Sign in | Register to Bookmark

High Performance Automotive Image Sensors using CMOS Wafer Stacking Technology

Automotive Image Sensors are required to perform a variety of functions including backup/rear view, surround view, e-mirrors, internal cabin monitoring and front facing machine vision. To enable all of these applications the performance and features of automotive CMOS image sensors must continuously be improved. These varied applications require low light performance at high temperatures, ultra-high intra-scene dynamic range & 120dB, high NIR QE & 50%, fast frame rates, LED flicker mitigation, state of the art security and safety features, low power dissipation, and a small foot print all at an affordable price. To achieve all these requirements in a single cost-effective CMOS process is almost impossible. Therefore, we developed a state-of-the-art wafer stacking technology. This enables us to separately optimize the photo-sensitive pixel wafer from the mixed-mode readout wafer. The pixel wafer is optimized for QE, full well capacity, dark current and read noise, while the mixed-mode wafer is optimized for transistor density, power dissipation and speed. In this presentation we describe our wafer stacking process and present results from our newest OX03C image sensor that uses this fundamental technology.
Released on: June, 2020

Unlimited AutoSens

An AutoSensPLUS subscription is required to watch this video on demand.

Presentations, panel discussions, interviews and more from all AutoSens events, with brand new content streamed both live and on demand.

£99

PER YEAR

Want to watch this FREE session?

You must be logged in to watch this session.

Please either login or create an account below.

Already a subscriber? Please Log in

More on the topic

Sign in | Register to bookmark

More from the partners

Scroll to Top