Anisotropic Conductive Film (ACF) will be discussed as a key enabler for miniaturization and cost reduction of automotive-grade sensors. The adhesive film with dispersed conductive particles is a superior substitute for solder pastes, mechanical clips, and wire bonding, all of which have inherent vulnerabilities when the form factor of sensors shrinks. By optimizing the particle size, film thickness, and particle configuration, these films ensure design freedom for variations in architecture, and safeguard that fine pitch applications can achieve connectivity without the risk of shorts. Finally, a particle-arrayed ACF is described as a new solution for further miniaturization.