You must be logged in  to watch this session

Your personal data will be used to support your experience throughout this website, to manage access to your account, and for other purposes described in our privacy policy.

Sense Media, on behalf of AutoSens, needs the contact information you provide to us to update you with information about AutoSens and our products. You may unsubscribe from these communications at anytime. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, check out our privacy policy.

Chip-scale LiDAR for affordability and manufacturability

Event: AutoSens Brussels
, 2022

Hear from:

dongjae shin
dongjae shin
Dongjae Shin
Principal Researcher,

Samsung

dongjae shin
dongjae shin
Dongjae Shin
Principal Researcher,

Samsung

LiDAR has been in explosive demands in various applications including autonomous driving, but the so-called “LiDAR lag” still persists. Since there are already LiDAR products providing excellent performance, the current LiDAR lag is presumably due to cost and manufacturability. To meet the market expectations behind this LiDAR lag, it might be inevitable to apply the silicon technology to LiDAR, as most of other sensors. However, due to the light source that cannot be implemented in silicon insofar, LiDAR has been outside the realm of the traditional silicon technology. In this presentation, we introduce a chip-scale solid-state LiDAR technology promising the cost and manufacturability advantages inherited from the silicon technology. The challenge of the light source integration has been overcome by the III/V-on-silicon technology that has just emerged in the silicon industry. With the III/V-on-silicon chip in the core, initial LiDAR module performance, performance scalability, and status of the ADAS-level field test are presented.

Passes0
There are no passes in your basket!
0