Enabling Safe and Scalable ADAS: Thermal Sensor Integration with MIPI CSI-2 and GMSL

You must be logged in to watch this session

First Name*

Last Name*

Job Title

Company Name

Country of Residence*

Work E-mail Address*

Password*

Confirm Password*

Your personal data will be used to support your experience throughout this website, to manage access to your account, and for other purposes described in our privacy policy.

Sense Media, on behalf of AutoSens, needs the contact information you provide to us to update you with information about AutoSens and our products. You may unsubscribe from these communications at anytime. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, check out our privacy policy.

Only fill in if you are not human

Enabling Safe and Scalable ADAS: Thermal Sensor Integration with MIPI CSI-2 and GMSL

Event: AutoSens Europe

| Session date: Wednesday 8th October

Session date: Wednesday 8th October

, 2025

Hear from:

Bill Parrish

CoFounder and CTO,

Seek Thermal

Bill Parrish

CoFounder and CTO,

Seek Thermal

Thermal long-wave infrared (LWIR) imaging is emerging as a key enabler of Advanced Driver Assistance Systems (ADAS) functions such as Automatic Emergency Braking (AEB), FMVSS-127. Seek Thermal has developed next-generation automotive-grade thermal sensor chips that optimize size, weight, power, and cost (SWaP-C) while meeting stringent safety requirements. The novel Readout Integrated Circuit (ROIC) architecture integrates the MIPI CSI-2 protocol, supporting one-way high-speed thermal image transfer with low-speed control signaling. This design enhances data integrity via robust cyclic redundancy checks, streamlines system integration by eliminating FPGAs or microprocessors, and reduces both complexity and cost. Compatibility with Gigabit Media Serial Link (GMSL) further enables remote sensor placement, lightweight cabling, and low power consumption. Direct MIPI CSI-2 connectivity with ISPs and SoCs simplifies adoption across OEM and Tier 1 platforms. By combining safety, efficiency, and scalability, this architecture positions thermal sensors as critical components for advancing safe, cost-effective, and widely deployable ADAS solutions.