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Panel Discussion: Exploring Zonal, Central, and Chiplet Trends in Automotive Architectures: Vision and Sensing Perspectives

Event: AutoSens USA
| Session date: Thursday 23rd May
Session date: Thursday 23rd May
, 2024

Hear from:

Frank Schirrmeister
Frank Schirrmeister

Moderator

Frank Schirrmeister
Executive Director, System Solutions,

Synopsys

Eugene_Wang
Eugene_Wang
Eugene Wang
GM - Global Automotive ,

SemiDrive

Oran Gurewitz
Oran Gurewitz
Oran Gurewitz
Director of Automotive Customer Support,

Valens Semiconductor

Auston Payyippally
Auston Payyippally
Auston Payyappilly
Director Product Management,

Bosch

Srinivasa S Guntur
Srinivasa S Guntur
Srinivasa S Guntur
Sr Staff Functional Safety Engineer,

Rivian Automotive

Eugene_Wang
Eugene_Wang
Eugene Wang
GM - Global Automotive ,

SemiDrive

Oran Gurewitz
Oran Gurewitz
Oran Gurewitz
Director of Automotive Customer Support,

Valens Semiconductor

Auston Payyippally
Auston Payyippally
Auston Payyappilly
Director Product Management,

Bosch

Srinivasa S Guntur
Srinivasa S Guntur
Srinivasa S Guntur
Sr Staff Functional Safety Engineer,

Rivian Automotive

With the growing complexity of E/E architectures in automotive systems, ensuring future-proofing of vision and sensing capabilities is paramount. This requires a thorough understanding of architectural paradigm trends and their implications on ADAS/AV integration. How do architecture choices impact sensing capabilities, and what are the checks and balances associated with each approach?
In this panel discussion, we navigate the challenges presented by evolving architectures, with a focus on zonal, central, and chiplet approaches. We explore strategies for ensuring resilience and adaptability in vision and sensing systems amidst these shifts. Key considerations include balancing performance and cost, managing redundancy and complexity, addressing latency concerns, and maximizing scalability and integration. By dissecting these complexities and examining the trade-offs between distributed zonal processing, consolidated central control, and modular chiplet designs, the panel aims to provide actionable insights for stakeholders. 

 

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