AutoSens China

24-26 November, 2026

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Intercontinental Hefei 5* Hotel

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#autosenschina

Why AK 3.0 Matters: Next-Generation ASSP Strategy 

China

Presentation
Why we need AK 3.0 ultrasonic IC driver ASSP – novel ultrasonic transducer with multiple elements (Ksense) and onsemi next generation beamforming ultrasonic control IC (AK3.0) are used to directly measure (not estimate) object height – next generation ultrasonic sensor architecture enabling
generation of ultrasonic 4D point cloud (x,y,z, Doppler) at system level. onsemi AK 3.0 ultrasonic driver IC with novel quad channel (vs AK 2.0 dual channel) operations and improved analog front-end (extended dynamic range) is going to visibly extended AK 3.0 ultrasonic sensor performance vs AK 2.0 ultrasonic sensor.
onsemi AK 3.0 driver IC use cases in combination with wide band ultrasonic transducer and next generation multiple elements ultrasonic transducer.
Highlighting benefits of AK 3.0 ultrasonic driver IC vs AK 2.0 ultrasonic driver IC and development timeline.

Hear from:

Lance Wu (Naichang)
USS BU Managing Director,
Keboda
Marek Hustava web
Product Architect - onsemi Design Center Brno,
onsemi
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