This presentation focuses on improving EMC performance in automotive ADAS cameras through a mechanical–electrical co-design approach. The study identified enclosure gaps and inconsistent grounding as the primary causes of radiated emissions exceeding CISPR 25 limits in the GPS band. A novel solder-dot grounding technique was introduced to ensure reliable PCB-to-enclosure contact and maintain Faraday cage integrity. Using fault tree analysis, ultrasonic scanning, pressure mapping, and DOE validation, the optimized design significantly reduced emissions and achieved full EMC compliance. The proposed solution provides a cost-effective, scalable method for enhancing shielding performance in next-generation ADAS and autonomous vehicle camera systems.”
