AutoSens USA 2025 hosted its annual Detroit conference this June, returning with co-host event InCabin USA for the second time.
The three-day event offered a packed programme of in-depth tutorials, expert-led roundtables, and an exhibition floor showcasing the latest innovations and advancements in ADAS technology.
On Wednesday 11th June, five leading exhibitors took part in a joint press conference, presenting new products and discussing their latest developments in automotive technology. Key topics included the advancement of smaller, more powerful in-car sensors, as well as progress in alcohol impairment detection technologies, reflecting the evolving safety requirements for ADAS features.
Read on for a full recap of the company presentations at AutoSens USA 2025.
At this year’s AutoSens USA press conference, Seek Thermal launched its next-generation thermal sensor technology, designed with an emphasis on functional safety and cost-effective performance.
The new Eagle Sensor series represents the latest generation of LWIR thermal sensors, offering enhanced imaging precision and capabilities. Featuring a state-of-the-art MIPI CS-2 interface, the sensors enable seamless integration with existing ADAS ECUs, while built-in safety features support greater reliability in automotive applications.
The sensors also feature optimised pixel and packaging designs, delivering discrete sensor modules and customisable camera solutions. This allows OEMs to achieve scalable, low-cost, high-performance solutions that help meet both pricing and production capacity targets.
Fritz Krainer, SVP of Engineering, said of the update: “This is more than an upgrade – it’s a transformative leap. Our new architecture is designed with automotive integration in mind, offering advanced imaging capability, seamless connectivity, and performance that scales.”
Dexerials showcased its range of optical solutions for ghost image reduction, anti-fogging, and seamless design, demonstrating how the application of nanostructures to substrate surfaces can reduce optical noise and enhance sensing technologies.
The company’s micro- and nanofabrication technology make up its core product, developed initially for automotive displays and HUD applications. The method used for moth-eye nanofabrication involves techniques such as nanoimprint lithography or photolithography to create nanostructures on the surface of different substrates. These nanostructures are composed of polymers with unique properties to minimise reflection and maximise transmittance, making them an optimal optical solution for sensor applications.
The technology also enables the development of advanced functional resins, including anti-fogging coatings for nanoimprinting and low-reflective black inks that perform effectively across the visible to near-infrared NIR spectrum.
Thank you Keisuke Kurasaki, Sales and Marketing Specialist at Dexerials, for joining us at AutoSens USA 2025.
KD took to AutoSens USA to present the KD7251 – the first optical multigigabit transceiver for automotive ethernet, compliant with IEEE standard 802.3cz.
It implements the nGBASE-AU physical layers in a single-chip solution, supporting speeds of 10, 5 and 2.5 Gb/s. It also includes bridging functionalities to enable the connectivity of sensors, displays, and processors in the vehicle.
The KD7251 transceiver guarantees the highest component-level EMC compliance without the need for any external additions. This results in a port with a small PCB area and a reduced Bill of Materials (BOM), with no need for ESD protections, common mode chokes, EMI filters or DC blocks. The bridging functionalities enable the connectivity of MIPI sensors, such as cameras and radar (CSI-2®), displays (DSI-2℠), or AI processors (PCIe®) in the vehicle. The KD7251 reaches 40 meters with four inline connectors over standard duplex OM3 multi-mode glass optical fibre (MM-GOF) at 10 Gb/s in the whole temperature range.
KD also discussed its Lopez fibre connections, providing robust connections with high speed, flexible installation and competitive prices, all with no electromagnetic interference. These fibre connections provide vital developments for the future of automotive technologies that rely on fast and reliable data communications.
Robert van Hamersveld spoke at AutoSens USA and said that “we are excited to provide the first implementation of the IEEE Std 802.3cz in our new KD7251 transceiver. It’s the first chip to integrate electronics, photonics, and optics in a single IC component.”
rFpro joined the press conference to discuss its development into in-cabin monitoring through its award-winning simulation software. The brand’s market-leading technology will now also be applied to interior-facing sensor systems, addressing the growing importance of in-cabin monitoring for safety and autonomy.
The latest developments will support AV elevate, rFpro’s simulation platform for ADAS and autonomous vehicle development, extending its capabilities to include interior sensor tuning, training, and testing alongside the existing exterior sensor simulation. The company will adapt its simulation tools to model human movement and skin appearance, develop higher detailed replicas of vehicle interiors, and create in-cabin specific edge case scenarios for testing. It will also develop new sensor type integrations for near-infrared and thermal infrared, introducing new technologies to the rFpro platform.
Interior modelling will include human movement, skin appearance, and clothing, as well as developing higher detailed replicas of vehicle interiors to create cabin-specific scenarios for simulated testing. These simulations allow for reliable and repeatable testing of small changes in controlled environments, removing subjective conditions in timings, weather, and road conditions. This allows testing and development to be quicker with reduced development costs.
Matt Daley, Technical Director at rFpro, explained how “a lot of our existing technologies can be applied to interior-facing sensors with some adaptation. By covering both exterior and interior sensing, we’re providing the industry with tools to accelerate the safe deployment of intelligent and autonomous vehicles.”
Valens Semiconductor joined AutoSens USA to speak about its recent partnership with Mobileye in the production of automated and autonomous production programmes.
Valens’ VA7000 MIPI A-PHY-compliant chipsets will serve as the in-car sensor and connectivity infrastructure for the Mobileye EyeQ™ 6 High automated and autonomous production programmes, currently in development with a group of global automotive brands. This represents a significant milestone for the automotive industry, advancing the adoption of global standards for high-speed connectivity.
The MIPI Alliance is a global standard for next-generation sensor connectivity, based on best in-class EMC performance, simple architecture, and end-to-end safety. MIPI A-PHY delivers efficient and robust high-performance standardised connectivity, and the development of these chipsets allows a broadening of the ecosystem with the ability to deliver this technology to more market-leading automakers.
Valens’ existing chipsets are already integrated into many devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving.
Daniel Shwartzberg, Director of Business Development, discussed the partnership and said: “Mobileye’s selection of our VA7000 chipset proves that our solution is well positioned to deliver data at high accuracy. With a transformative company such as Mobileye validating the performance of the Valens VA7000 A-PHY chip, this collaboration marks a significant milestone for the entire automotive industry.”
Conclusion
AutoSens USA highlighted new advancements in both external and internal automotive technologies, including ADAS sensors and supporting infrastructure. Hardware is becoming increasingly robust, more cost-effective, and higher performing, while software, including simulation tools, is enabling technological development at greater scale and speed, helping to reduce costs across multiple areas.
To learn more about all the exhibitors at AutoSens USA 2025, view our full list here.
Interested in in-cabin monitoring technology?
With a pass to AutoSens Europe, you’ll also get full access to our co-located sister event, InCabin. See the Agenda for InCabin Europe here >>
